JPH0472393B2 - - Google Patents

Info

Publication number
JPH0472393B2
JPH0472393B2 JP63304903A JP30490388A JPH0472393B2 JP H0472393 B2 JPH0472393 B2 JP H0472393B2 JP 63304903 A JP63304903 A JP 63304903A JP 30490388 A JP30490388 A JP 30490388A JP H0472393 B2 JPH0472393 B2 JP H0472393B2
Authority
JP
Japan
Prior art keywords
light emitting
emitting diode
recessed part
diode chip
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP63304903A
Other languages
English (en)
Japanese (ja)
Other versions
JPH02151086A (ja
Inventor
Tadaaki Ikeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP63304903A priority Critical patent/JPH02151086A/ja
Publication of JPH02151086A publication Critical patent/JPH02151086A/ja
Publication of JPH0472393B2 publication Critical patent/JPH0472393B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Led Device Packages (AREA)
JP63304903A 1988-12-01 1988-12-01 発光ダイオード Granted JPH02151086A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63304903A JPH02151086A (ja) 1988-12-01 1988-12-01 発光ダイオード

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63304903A JPH02151086A (ja) 1988-12-01 1988-12-01 発光ダイオード

Publications (2)

Publication Number Publication Date
JPH02151086A JPH02151086A (ja) 1990-06-11
JPH0472393B2 true JPH0472393B2 (en]) 1992-11-18

Family

ID=17938678

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63304903A Granted JPH02151086A (ja) 1988-12-01 1988-12-01 発光ダイオード

Country Status (1)

Country Link
JP (1) JPH02151086A (en])

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0465465U (en]) * 1990-10-18 1992-06-08
JPH10294493A (ja) * 1997-02-21 1998-11-04 Toshiba Corp 半導体発光デバイス
JP3644927B2 (ja) * 2000-03-17 2005-05-11 松下電器産業株式会社 面発光装置
JP2003179271A (ja) * 2000-03-17 2003-06-27 Matsushita Electric Ind Co Ltd 半導体発光装置，その製造方法及び面発光装置
JP3930710B2 (ja) * 2000-09-13 2007-06-13 シチズン電子株式会社 チップ型発光ダイオード及びその製造方法
JP4690563B2 (ja) * 2001-03-02 2011-06-01 シチズン電子株式会社 発光ダイオード

Also Published As

Publication number Publication date
JPH02151086A (ja) 1990-06-11

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees